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DP 5505

INTERFLUX® DP 5505 solder paste is

a halide free solder paste for lead free alloys.
It has

long tack and stencil life. Its wide process window and ease-of-use make it the first choice in lead free solder paste. It leaves minimal and pin testable residue.



arrow No-clean
arrow Pin testable
arrow Long tack and stencil life
arrow Minimal and clear residue
arrow Easy cleanable residue

 

 

 


DP 5505

 

  
Application

Following values are guidelines and have been obtained from practical situations.
 
Printing:
Speed 10 - 150mm/sec
Squeegee pressure 250g per 1cm blade
U.S.C. interval once every 20 boards
Abandon time
@ 22°C - 40% R.H.
> 1 hour
on 200µ round apertures
Temperature range 15 - 29°C
Tack time
@ 22°C - 40% R.H. 		> 8 hours
 
Flying probe testable  
Pin-bed testable  
   

 

Cleaning:
unreflowed paste INTERFLUX   ISC 8020
   
   
   
 
     
   
Technical specifications

 

 


viscosity
metal content
powder class


alloys



 


850 000cPs
85 - 88,5%
2-3-4 and 5
SAC305, SAC387, SAC405



documents		  
 

technical data sheet
product brochure

     msds
  Vigon A250 cleaning

 



packaging

DP 5505 is

syringes:
jar:    

cartridge:
    

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg
Proflow

 
Other types of packages are available upon request.





   
 
 
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