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Delphine 5503/2

INTERFLUX® Delphine 5503/2 solder paste is

the D5503 solder paste for lead free alloys taken a step further.
It has extremely long tack and stencil life. Its wide process window and ease-of-use make it the first choice in lead free solder paste. It leaves minimal and pin testable residue.



arrow No-clean
arrow Pin testable
arrow Tack: exeeding 120h

(*) 

arrow Abandon time : exeeding 2h(²)


arrow Does not block small size apertures
arrow Minimal and clear residue
arrow Easy cleanable residue

 

 

 


Delphine 5503-2

  

 

note: * ambient conditions :18-25°C and 40-60% R.H.
         ² on smallest apertures size 250µm diameter

Application

Following values are guidelines and have been tested in practical situations.
 
Printing:
Speed 20 - 150mm/sec
Squeegee pressure 250g per 1cm blade
U.S.C. interval once every 20 boards
Abandon time
@ 22°C - 40% R.H.
> 2 hours
on 200µ round apertures
Temperature range 15 - 39°C
Tack time
@ 22°C - 40% R.H. 		> 120 hours
 
Flying probe testable  
Pin-bed testable  
   

 

Cleaning:
unreflowed paste INTERFLUX   ISC 8020
VIGON SC200
SC202
SC400
ZESTRON SD300
SD301
ATRON SP200
 
post reflow residue VIGON A200
A300
ZESTRON FA+
VD
Technical specifications

 

 


viscosity
metal content
powder class


alloys



 


850 000cPs
85 - 88,5%
2-3-4 and 5
SnCu, SnAg and SAC


documents		  
  technical data sheet
safety data sheet


packaging

Delphine 5503/2 is

syringes:
jar:    

cartridge:
    

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg
Puck Pack and Proflow

 
Other types of packages are available upon request.





VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com  
 
 
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