Interflux® - Product file Delphine 5503

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INTERFLUX® Delphine 5503 solder paste is

the new standard solder paste for lead free alloys.
It has

long tack and stencil life. Its wide process window and ease-of-use make it the first choice in lead free solder paste. It leaves minimal and pin testable residue.

No-clean
Pin testable
Long tack and stencil life
Minimal and clear residue
Easy cleanable residue

Delphine 5503

Following values are guidelines and have been tested in practical situations.

Printing:

Speed	20 - 150mm/sec
Squeegee pressure	250g per 1cm blade
U.S.C. interval	once every 20 boards
Abandon time @ 22°C - 40% R.H.	> 1 hour on 200µ round apertures
Temperature range	15 - 39°C
Tack time @ 22°C - 40% R.H.	> 24 hours

Flying probe testable
Pin-bed testable

Cleaning:

unreflowed paste

INTERFLUX

ISC 8020

VIGON

SC200
SC202
SC400

ZESTRON

SD300
SD301

ATRON

SP200

post reflow residue

VIGON

A200
A300

ZESTRON

FA+
VD

viscosity metal content powder class alloys	850 000cPs 85 - 88,5% 2-3-4 and 5 SnCu, SnAg and SAC
documents
	technical data sheet safety data sheet product brochure
hojas en Español
	hojas técnicas hojas de seguridad

packaging

Delphine 5503 is

syringes:
jar:

cartridge:

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg
Puck Pack and Proflow

Other types of packages are available upon request.

VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com