Interflux® - Product file Delphine 5504

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INTERFLUX® Delphine 5504 solder paste for lead free alloys is

specially developed to give extremely low voiding with bga and conventional joints.
Delphine 5504 is a no-clean, halide free solder paste with

long tack and stencil life.
Its wide process window and abandon time make it the first choice in lead free reflow in both air and nitrogen. It leaves minimal, pin testable residue.

Extremely low voiding
No-clean, halide free
Pin testable
Long tack and stencil life
Minimal and clear residue

Following values are guidelines and have been tested in practical situations.

Printing:

Speed	20 - 150mm/sec
Squeegee pressure	250g per 1cm blade
U.S.C. interval	once every 20 boards
Abandon time @ 22°C - 40% R.H.	> 1 hour on 200µ round apertures
Temperature range	15 - 39°C
Tack time @ 22°C - 40% R.H.	> 24 hours

Flying probe testable
Pin-bed testable

Cleaning:

unreflowed paste

INTERFLUX

ISC 8020

viscosity metal content powder class alloys	1.000.000cPs 88 - 88,5% 2-3-4 and 5 SnCu, SnAg and SAC
documents
	technical data sheet safety dat sheet

packaging

Delphine 5504 is

syringes:
jar:

cartridge:

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg
Puck Pack and Proflow

Other types of packages are available upon request.

VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com