Interflux® - Product file IF 2005M

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	INTERFLUX® IF 2005M is a low solids no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. With no rosin or resin to create a sticky residue, there are no contact problems caused by post-solder flux residue. This halide free flux meets all Bellcore and IPC requirements and is QPL-listed. It provides great solderability on HAL, NiAU and OSP-coated PCB's. IF 2005M also provides excellent solderability on lead free alloys. It has a longer life in the foam fluxer compared to synthetic fluxes, making it the most cost-effective choice for no clean soldering.

IF 2005M can be applied by foam and spray fluxer systems, dipping, brush, flux pen, etc.

Density control :

1.	The density of the IF 2005M flux can be checked using the IF density meter. The value shown by the density meter should be compared, after temperature compensation, with the value in the 2005M density table and adjusted when needed with T 2005M thinner.

Titration check :

2.	IF 2005M solid content can be checked by using the Titration Kit for IF 2005M. Adjusting the solid content can be done by using the T 2005M thinner.

appareance
density at 20°
solid content
j-std-004A class.
acid number

clear, colorless liquid
0.808g/ml
1,8 %
OR/ L0
14 - 16 mg KOH/g

documents

technical data sheet

packaging

Interflux IF 2005M is available in 1L, 10L, 25L and 200L containers