 |
INTERFLUX® IF 8300-4 BGA gel flux
has resin-like rheological properties.
It is completely halogen-free,
guaranteeing long term reliability
and extreme good solderability capabilities. IF 8300 easily withstands lead
free and normal reflow profiles, and the flux medium
is designed to volatise at these
temperatures. The minimal, transparant
residue does not require cleaning.
The BGA gel flux can be applied by
printing, dispensing or with a brush. IF 8300-4 is available
in different vioscosities, such as IF 8300 or IF 8300-6, for
different applications.
IF 8300 is suitable for lead free soldering. |
|

| |