Interflux® - Product file IF 8300

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	INTERFLUX® IF 8300-6 BGA gel flux has resin-like rheological properties. It is completely halogen-free, guaranteeing long term reliability and extreme good solderability capabilities. IF 8300 easily withstands lead free and normal reflow profiles, and the flux medium is designed to volatise at these temperatures. The minimal, transparant residue does not require cleaning. The BGA gel flux can be applied by printing, dispensing or with a brush. IF 8300-6 is available in different vioscosities, such as IF 8300 or IF 8300-4, for different applications. IF 8300-6 is suitable for lead free soldering.

The 8300 bga gel flux shall be used as received. The optimum working temperature is 18-25 °C.

directly from syringe :

clean the surfaces which have to be soldered prior to applying the gel flux

apply just enough flux to hold component

solder component

by brush :

1.	clean the surfaces which have to be soldered prior to applying the gel flux
2.	use the build in brush to apply ust enough flux to hold component
3.	solder component

state
j-std-004a class.
odour
ph
viscosity

viscous
RE/ L0
mildly sweet odour
3

25.000cPs

documents

technical data sheet

packaging

Interflux 8300-6 BGA gel is available 30cc brush bottles