Interflux® - Product file IF 9009lt

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INTERFLUX®

IF 9009lt solder paste is

a slightly higher activated solder paste for lead free alloys.
It has

good tack and stencil life. Its activation level makes it the choice for soldering surfaces with poor wetting ability. It is a No-clean formula with a minimal contend of halogen. It leaves clear and pin testable residue.

No-clean
Pin testable
Low voiding
Minimal and clear residue
Easy cleanable residue

IF 9009lt

Following values are guidelines and have been tested in practical situations.

Printing:

Speed	20 - 80mm/sec
Squeegee pressure	250g per 1cm blade
U.S.C. interval	once every 20 boards
Stencil life @ 22°C - 40% R.H.	> 24 hours
Temperature range	15 - 39°C
Tack time @ 22°C - 40% R.H.	> 100 hours

Cleaning:

unreflowed paste

INTERFLUX

ISC 8020

VIGON

SC200
SC202
SC400
US

ZESTRON

SD300
SD301

ATRON

SP200

post reflow residue

VIGON

A200
A300
SC202

ZESTRON

FA+
VD

viscosity
metal content
powder class

alloys

850 000cPs
88%
2-3-4 and 5
SnCu, SnAg and SAC

documents

technical data sheet

safety data sheet

packaging

IF 9009lt is

syringes:
jar:

cartridge:

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg

Other types of packages are available upon request.

VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com