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NX 9900i

INTERFLUX® NX 9900i solder paste is

the new standard solder paste for SnPb and SnPbAg alloys.
It has extremely long tack and stencil life. Its wide process window and ease-of-use make it the first choice in solder paste. It leaves minimal and pin testable residue.



arrow No-clean
arrow Pin testable
arrow Long tack and stencil life
arrow Minimal and clear residue
arrow Easy cleanable residue

 

 

 


NX 9900i

  
Application

Following values are guidelines and have been tested in practical situations.
 
Printing:
Speed 20 - 150mm/sec
Squeegee pressure 200g per 1cm blade
U.S.C. interval once every 20 boards
Abandon time > 1 hour
Temperature range 15 - 39°C
Tack time
@ 22°C - 50% R.H. 		> 72 hours
 
Flying probe testable  
Pin-bed testable  
   

 

Cleaning:
unreflowed paste INTERFLUX   ISC 8020
VIGON SC200
SC202
SC400
ZESTRON SD300
SD301
ATRON SP200
 
post reflow residue VIGON A200
A300
US
ZESTRON FA+
Technical specifications

 

 


viscosity
metal content
powder class


alloys



 


950 000cPs
85 - 90,25%
2-3-4 and 5
Sn62, Sn63 and AT*

*stands for anti-tombstone



documents		  
  technical data sheet
safety data sheet
product brochure


packaging

NX 9900i is

syringes:
jar:    

cartridge:
    

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg
Puck Pack and Proflow

 
Other types of packages are available upon request.





VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com  
 
 
© 2006 All Rights Reserved by Interflux Electronics