INTERFLUX® IF 2009M is a low solids VOC free,
no-clean flux, its ingredients are
designed to evaporate during the
soldering process. Thus, making it
very safe to use in high-reliability
application circuits. With no rosin
or resin to create a sticky residue, there
are no contact problems, caused by
post-solder flux residue. This halide
free flux meets all Bellcore and
IPC requirements.
It provides great solderability on
HAL, NiAU and OSP-coated PCB's.
IF2009M
also provides excellent solderability
on lead free alloys.
Application
PacIFic 2009M can
be applied by
spray fluxer
systems, dipping,
brush, flux pen,
etc.
Wave
soldering :
1.
2.
3.
PacIFic
2009M only
needs
to be
supplied
for 50%
of the
amount
of an
low solids
alcohol
based
flux.
Pre heating
temperature
range (top
side board)
100°C - 160°C.
Wave contact
times 2s
- 5s
Density
control :
None
needed
- no
thinner
is required
Technical
specifications
appareance
density at 20°
solid content
j-std-004A
class.
acid number
