Interflux® Product file - PacIFic 2009Mlf

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	INTERFLUX® IF 2009MLF is a low solids VOC free, no-clean flux, its ingredients are designed to evaporate during the soldering process. Thus, making it very safe to use in high-reliability application circuits. The flux is designed to, and has proven to reduce dramatically solder ball formation in wave soldering processes. This halide free flux meets all Bellcore and IPC requirements. It provides great solderability on HAL, NiAU and OSP-coated PCB's. PacIFic 2009MLF also provides excellent solderability on lead free alloys.

PacIFic 2009MLF can be applied by spray fluxer systems, dipping, brush, flux pen, etc.

Wave soldering :

1.

2.

3.

PacIFic 2009MLF only needs to be supplied for 50% of the amount of an low solids alcohol based flux.
Pre heating temperature range (top side board) 100°C - 160°C.
Wave contact times 2s - 5s

Density control :

	None needed - no thinner is required

appareance
density at 20°
solid content
j-std-004A class.
acid number

transparent liquid
1.00g/ml
3,7 %
OR/ L0
24 mg KOH/g

documents

technical data sheet

safety data sheet

packaging

Interflux PacIFic 2009MLF is available in 1L, 10L, 25L and 200L containers