Interflux® - Product file WSP 2006

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INTERFLUX® WSP 2006 solder paste is

an absolute halide free, water soluble solder paste for both lead bearing and lead free alloys.
It has

good tack and stencil life. Its wide process window and ease-of-use make it the first choice in water soluble solder paste. It leaves minimal and easy cleanable residue.

Water Soluble
Pin testable
Good tack and stencil life
Minimal and clear residue
Easy water washable residue

WSP 2006

Following values are guidelines and have been tested in practical situations.

Printing:

Speed	20 - 80mm/sec
Squeegee pressure	250g per 1cm blade
U.S.C. interval	once every 20 boards
Abandon time @ 22°C - 40% R.H.	> 1 hour
Temperature range	15 - 39°C
Tack time @ 22°C - 40% R.H.	> 24 hours

Cleaning:

post reflow residue must always be cleaned within 3 days after reflow. Cleaning can be done in D.I. water of 50-60°C (120°F-140°F).

WSP 2006 is not a No-clean solder paste.

viscosity
metal content
powder class

alloys

850 000cPs
85 - 88,5%
2-3-4 and 5
SnCu, SnAg and SAC
Sn62, Sn63 and AT

documents

technical data sheet

safety data sheet

packaging

WSP 2006 is

syringes:
jar:

cartridge:

available in

10 and 30 cc

500g
500g, 1kg, 1.2kg and 1.3kg

Other types of packages are available upon request.

VIGON®, ZESTRON® and ATRON® are registered trademarks of Dr O.K. Wack Chemie GmbH to be reached at www.zestron.com